Areas of competence
- Investigation of wire bond contacts
- Materials testing
- Determination of mechanical properties, tensile test, hardness measurement, mobile hardness measurement, nondestructive testing
- Ultrasonic testing, coat thickness measuring, metallography
- Investigation of material surfaces and layer systems
Laboratories
- Materials technology
Equipment
- Tensile testing machine TIRATEST 24100
- Impact testing machine Kögel KSG 3/75 150 J
- Vickers hardness measuring ZWICK ZHV 10
- Universal hardness measuring EMC M4U
- Rockwell hardness measuring REICHERTER VA-MC
- Mobile hardness measuring system TH 160
- Ultrasonic layer thickness device TI-25 WOP
- FISCHER Dualoscope MP4C for layer thicknesses measuring
- Magnetic powder cracking test
- Muffle furnace (1200°C)
- Optical and Scanning Electron Microscopy
- Metallography
Patents / inventions
- WO/2008/028906: Method and Device for Controlling the Generation of Ultrasonic Wire Bonds (Holger Gaul, Herbert Reichl, Martin Schneider-Ramelow, Klaus-Dieter Lang, Ute Geißler)
- WO/2014/079726 / PCT/EP2013/073541: Aluminium alloy wire for bonding applications (E. Milke, S. Thomas, U. Geißler, M. Schneider-Ramelow)
Membership in networks
- IMAPS (International Microelectronics and Packaging Society)
Cooperation
- Fraunhofer IZM
- TU Berlin, Electronic Packaging
- F&K Delvotec Bondtechnik Ottobrunn
- Heraeus Electronics Hanau
- Rehm Thermal Systems
- Geißler vehicle manufacturing GmbH